Amaoe MI 13

Precision Application:
This PCB stencil enables accurate placement of solder paste directly onto SMD pads, ensuring secure component positioning during soldering.

Reballing Support:
Perfect for BGA and IC reballing tasks, allowing uniform solder ball application for reliable chip reinstallation.

Device-Specific Fit:
Engineered to match the exact pad layout of supported smartphone and PCB models for proper alignment.

Micro Aperture Layout:
Laser-cut openings deliver controlled solder volume, minimizing bridging and improving solder quality.

Durable Construction:
Made from high-strength metal to withstand repeated use and high-temperature repair environments.