MIJING MS1

Mijing iRepair MS1 Intelligent Universal Desoldering Platform for iPhone X to 16Pro Max

Features:

• Accurate positioning (heating part required)
• Silica gel heat insulation, high-temperature resistance, reduce the bottom contact surface temperature.
• High quality and stable heat transfer and heat acceptance.
• Only heat the area of the motherboard that needs to be removed to prevent improper heating.
• Double bayonet design to ensure that the motherboard is stable on the stage. 
• Expand different modules and choose according to your needs
• Packing size: 220 * 158 * 50mm
• Working for iPhone X/Xs/Xs Max/11/11 Pro/11Pro Max/12 Mini/12/12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15 Plus/15 Pro/15Pro Max/16/16 Plus/16 Pro/16Pro Max