YCS H03

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PCB STAND
1100.00

YCS H03 Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair


Features:

  • Fully applicable to various types of chips/motherboards

  • Removal tin and glue, no need to adjust the direction, travel coaxial movement

  • For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife

  • Motherboard cleaning doesn't require adjusting the orientation, clean up at once

  • The module is suitable for various sizes of motherboards in all aspects

YCS H03 Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair


Features:

  • Fully applicable to various types of chips/motherboards

  • Removal tin and glue, no need to adjust the direction, travel coaxial movement

  • For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife

  • Motherboard cleaning doesn't require adjusting the orientation, clean up at once

  • The module is suitable for various sizes of motherboards in all aspects

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